|Total load resistance||Shelf load capacity
(Included shelf weight)
|Floor load||Inside dimension
(W x H x D)
|-||-||-||600 x 600 x 600 mm||atmospheric pressure to 133 PA Within 15 min
Inlet open to atmosphere
Within 8 min
|温度 : +40°C to +200°C
Pressure : 933 x 102 Pa to 1 x 102 Pa
A vacuum (low-pressure) environment has a lower boiling point, allowing drying treatments at a lower temperature. The vacuum oven enables drying treatment at a lower temperature for specimens that cannot be treated by conventional high-temperature drying. Furthermore, the vacuum and N2 gas exchange modes enable drying of oxidation-averse specimens, as well as drying and heat treatment within a clean environment by eliminating impurities in the chamber through repeated heat treatments or gas exchanges.
The ovens are ideal for many applications, especially in electronic component production: defoaming when mixing silicone rubber or resins in LED production, deaerating during resin forming, hardening when injecting epoxy for hybrid ICs , or drying electronic components after washing.
Power consumption was reduced through improved air-tightness and insulation achieved by using superior insulation materials and by changing both the door locking mechanism and the enclosure construction. Air-tightness and insulation capacity have a significant impact not only on temperature control but also on pressure control. Through improvement of these properties, the VAC-101 achieves up to 40％ energy savings. In addition, the enhanced air-tightness helps prevent a temperature rise in the surrounding area of the chamber.
The vacuum chamber features double-layered construction. A heater on the exterior of the test area minimizes heat loss and improves temperature uniformity. This allows even more uniform heat treatment and improves machine efficiency by reducing heat up time.
Complies with safety of Machinery (ISO 12100), Low Voltage (IEC 60204), EMC (EN 61000-6-2, 55011).
Test area (The shelves and hermetic terminals are optional.)